产品性质 热销 营销方式 厂家直销 营销价格 特价 四层电路板 阻抗 金手指 盲孔 埋孔 HDI 沉头孔 盘中孔 BGA 技术指标 制作能力 层数Layers 1-32层 基板厚度Material Thickness 0.3-3.2 板材类型Material Type FR-4,Halogen free,High TG,94VO,94HB,CEM-1 板材供应商Material Supplier KB,Nanya,Shengyi,Doosan 铜箔厚度Copper Thickness 0.5-5OZ 阻燃特性Flammability Rating 94V-0 抗剥离强度Peel Strength 12.3n/cm 翘曲度Warp And Twist ≤0.75% 绝缘电阻Insulation Resistor ≥5MΩ 测试电压Test Voltage 100-300V 成品板面积 Finished Board Size 560X1500mm 较小线宽线距Min Line Width/Space 0.05/0.05mm 孔壁铜厚 Hole Wall Copper Thickness ≥15um 外层较小焊环Outer Minimum Annual Ring ≥0.125mm 较小孔径Min Hole. 0.1mm PTH/NPTH孔径公差 Hole Diam Tolerance 0.05/0.025mm(PTH/NPTH) 机锣外形公差Routing Outling Tolerance ±0.10mm 冲板外形公差Punching Outling Tolerance ±0.10mm 绿油桥能力Solder Mask Bridge ≥4Mil 阻焊硬度Solder/Mask Hardness 6H 油墨供应商S/M Ink Supplier Nanya,Taiyo,Tamura,Coates 阻焊耐焊性S/M Solderability 245℃ 10Sec 热冲击能力Hot Immersion Ability 288℃ 10Sec 表面镀层Surface Plating 喷锡,无铅喷锡,钴金,厚金,沉金,抗氧化,沉银,镀镍 HAL,HAL LF,Immersion-Sn,Immersion-Au,Immersion-Au,OSP.Sink-Ag,Plating-ni 质量标准Quality Standard IPC-A-600G,IPC-TM-650,IPC-6012B 阻焊类型Solder Mask Type 液态感兴阻焊LPI,哑光 文字Legend 热固 Heat-Cure Ink 交期承诺